Advances in Joining of Ceramics, Volume 138

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G. Ravi and R. 5 wt% Y sub 2 O sub 3 (Y-TZP) ceramics using nanocrystalline tape cast interlayers", J. Materials Science, 37[4]: 813-818,2002. 73. R. J. Xie, M. Mitomo, G. D. Zhan, L. P. Huang and X. R. Fu, "Diffusion bonding of silicon nitride using a superplastic beta-SiAlON interlayer", J. Amer. Ceram. Soc. 84 [2]: 471-473, 2001. 27 Advances in Joining of Ceramics 74. P. A. Lessing, A. W. Erikson and D. C. Kunerth, "Electrophrotectic deposition (EPD) applied to reaction joining of silicon carbide and silicon nitride ceramics", J.

Mater. Synth. Process, 6[6]: 387 - 392, 1998. 72. B. G. Ravi and R. 5 wt% Y sub 2 O sub 3 (Y-TZP) ceramics using nanocrystalline tape cast interlayers", J. Materials Science, 37[4]: 813-818,2002. 73. R. J. Xie, M. Mitomo, G. D. Zhan, L. P. Huang and X. R. Fu, "Diffusion bonding of silicon nitride using a superplastic beta-SiAlON interlayer", J. Amer. Ceram. Soc. 84 [2]: 471-473, 2001. 27 Advances in Joining of Ceramics 74. P. A. Lessing, A. W. Erikson and D. C. Kunerth, "Electrophrotectic deposition (EPD) applied to reaction joining of silicon carbide and silicon nitride ceramics", J.

57 Advances in Joining of Ceramics 38 CONCLUSIONS In graded joint design it is clear that one must account for both applied and residual stresses, and that very different failure modes obtain for joints with different toughness. Furthermore, the stress fields present in the absence of cracks, as one might obtain by finite element analysis, may not reveal the type of failure expected when flaws are present in the interlayers. The current work has shown that the type of failure within a graded joint may depend strongly on the architectural parameters and the toughness of the interlayer containing the critical flaw.

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